SEMI and partners to launch largest microelectronics education program

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SEMI along with its 19 partners from across 14 countries has launched an initiative to fill the skills gap and boost workforce diversity by tightening collaboration between the microelectronics industry and education providers. The project is titled, Microelectronics training, industry and skills (METIS). The project will be focusing on the skills and other training needed to support technologies such as artificial intelligence (AI), autonomous driving and Industry 4.0. METIS is designed to overcome the skills shortage in the microelectronics industry

The METIS consortium consists of SEMI, Infineon, Bosch, X-Fab, Graphenea, Summa, Arcelik, Silicon Saxony, Imec, Technical University of Graz, Dresden Chip Academy, University of South-Eastern Norway, Technical University of Sofia, Budapest University of Technology and Economics, Innovation Learning Work, Fast Track into Information Technology, European Association of Career Guidance, European Association for Women in Science, Engineering and Technology, CIMEA and Decision.

This project is going to boost online education and work based learning in microelectronics design and manufacturing. METIS is going to be a 4 year long project and is going to receive 4 million EUR in public funding. The program is also planning to promote workforce diversity in the sector and is also planning to target increased participation of underrepresented groups in microelectronics education and employment. The program is also going to focus and raising occupational profiles and skills which are going to be very important to the future of this sector.

Erasmus+ will be co-funding the program. The Consortium is going to develop new skills strategy for the microelectronics industry in Europe.  SEMI connects around 2100 member companies and more than 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. The members of SEMI are responsible for the innovation in materials, design and equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products.

 

 

 

 

 

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